Ligent Technologies, Inc.
纳真科技
Optical modules, optical chips and optical network terminals for AI and cloud
- Headquarters
- Qingdao, China
- Region
- Other China
- Founded
- 2003
- Stage
- Public
Overview
Ligent Technologies is an optical communications and connectivity supplier spun off from the Hisense Group, providing optical modules, optical chips and optical network terminals. It ranked fifth globally among merchant optical module vendors by 2025 revenue. The company listed on the HKEX Main Board on 22 September 2026.
Products
5800G / 1.6T data centre optical modules
High-end AI optical modules for data centre and AI cluster interconnect.
Optical chips (DFB / EML / CW-DFB)
In-house laser chips including 75mW high-power CW-DFB, built on buried heterostructure and ridge waveguide platforms.
Telecom optical modules
FTTx, transmission and wireless fronthaul modules.
Optical network terminals
Broadband access customer premises equipment.
Silicon photonics / CPO
Silicon photonics packaging and co-packaged optics for next-generation 3.2T links.
Highlights
5- 01Listed on the Hong Kong Stock Exchange main board on 22 September 2026 as Hisense Group's sixth listed company.
- 02Ranked fifth globally and third in China by 2025 optical module revenue, with shares of 4.0% and 10.1% respectively.
- 03Revenue grew from RMB 4.239 billion in 2023 to RMB 8.355 billion in 2025, a 40.4% compound growth rate; H1 2026 revenue was RMB 5.393 billion, up 27.9% year on year.
- 04One of the few companies globally with both optical module mass production and in-house optical chip design and manufacturing.
- 05Gross margin recovered from 17.4% in 2024 to 24.2% in H1 2026 as high-margin data centre modules and overseas revenue grew.
People
1
Industry chain
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Funding
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Events
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Topics
5Coverage
1Information compiled from public sources; refer to the company's official website for authoritative details.