Suzhou Tianmai Thermal Technology Co., Ltd.
苏州天脉
A domestic leader in thermally conductive and heat-dissipating materials, with mass production capability across heat pipes, vapor chambers, thermal interface materials and graphite films for leading consumer and communications brands.
- Headquarters
- Suzhou, Jiangsu, China
- Region
- Jiangsu
- Founded
- 2007
- Stage
- Public
Overview
Suzhou Tianmai Thermal Technology Co., Ltd. (301626.SZ) was founded in July 2007 and listed on the ChiNext board of the Shenzhen Stock Exchange on 24 October 2024 at an issue price of RMB 21.23 per share; it is headquartered in Wuzhong, Suzhou, Jiangsu. The company develops, produces and sells thermally conductive and heat-dissipating materials and components — heat pipes, vapor chambers, thermal interface materials (TIMs) and graphite films — widely used in smartphones, notebooks, surveillance equipment, automotive electronics and communications equipment. It is one of the few domestic high-tech firms with mass production capability for both mid-/high-end thermally conductive materials and high-performance heat-dissipating components, and its products are deployed in devices from Samsung, OPPO, VIVO, Huawei, Honor, Lenovo, CATL, Hikvision and Dahua, among others. 2025 revenue reached RMB 1.117 billion with net profit attributable to shareholders of RMB 0.155 billion.
Products
4Vapor chambers
High-performance phase-change heat-spreading components for high-power chips in mobile and AI devices.
Heat pipes
Ultra-thin heat pipes used in smartphones and notebooks for efficient heat transport.
Thermal interface materials
Silicone-based thermally conductive and heat-insulating materials bridging chips and heat sinks.
Graphite films
Graphite heat-spreading films for even temperature distribution in thin electronics.
Highlights
4- 012025 revenue of RMB 1.117 billion with net profit attributable to shareholders of RMB 0.155 billion.
- 02Listed on the ChiNext board on 24 October 2024 at an issue price of RMB 21.23/share, raising net proceeds of RMB 0.545 billion.
- 03In 2026, issued RMB 786 million of convertible corporate bonds ('Tianmai Convertible Bond', 123279), listed on the SZSE on 18 August 2026.
- 04Its vapor chambers and heat pipes are in mass supply to tier-1 consumer-electronics and thermal module makers, including BYD, AAC Technologies, Foxconn and Luxshare-related suppliers.
People
1
Funding
1- Source
IPO
CNY 5.4492 亿
Events
0Not yet listed
Related projects
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Topics
3Coverage
0Not yet listed
Information compiled from public sources; refer to the company's official website for authoritative details.