Shennan Circuits

Shennan Circuits was founded in Shenzhen in 1984 and listed on the Shenzhen Stock Exchange in December 2017. Manufacturing sits in Shenzhen, Wuxi and Nantong, with a subsidiary in North America and an R&D site in Europe. The company is the first national technology innovation demonstration enterprise in China's PCB industry and the country's earliest mover in IC packaging substrates; it also chairs the China Printed Circuit Association and its standards committee. Business spans three legs: printed circuit boards, IC substrates and PCBA electronic assembly.

• 01Q1-Q3 2026 revenue of RMB 25.77 billion (+53.8% YoY) and net profit of RMB 4.13 billion (+77.5% YoY), with gross margin at 32.6% and ROE at 22.1%.
• 02H1 2026 revenue of RMB 15.30 billion (+46.3% YoY) with net profit of RMB 2.25 billion (+65.5% YoY).
• 03Headcount stands at 21,211 with a debt-to-asset ratio of 56.9%; Yang Zhiqin serves as both chairman and general manager.

1. Dec 13, 2017

   IPO

   CNY 12.68 亿

   Source

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