Funding activity
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31recordsLast 6 months
Public disclosuresRecorded public funding disclosures
* Month to date: 2026-11-09 (UTC)
Amounts are shown as disclosed, in their original currency.
| Disclosed | Company | Sector | Round | Amount | Investors | Source |
|---|---|---|---|---|---|---|
| 2026-09-22 | Fanbote Robotics | Embodied AI & Robotics | Angel | Tens of millions (currency not disclosed) | — | Original |
| 2026-09-22 | Bairui Zhixin | Embodied AI & Robotics | Angel | Tens of millions of CNY | — | Original |
| 2026-09-22 | Guangyin Juhe | Chips | Pre-A | Tens of millions (currency not disclosed) | — | Original |
| 2026-09-21 | Lanxing Guangyu | Optics & Networking | Series C+ | Several hundred million CNY | — | Original |
| 2026-09-21 | Fangqi Technology | Embodied AI & Robotics | Undisclosed | Tens of millions (currency not disclosed) | — | Original GDELT |
| 2026-09-21 | Jie'endi Technology | Data Center Power | Series B | Nearly CNY 100 million | — | Original |
| 2026-09-21 | BOCO Electronics | Data Center Power | Series C | Undisclosed | — | Original |
| 2026-09-21 | Zhongyi Embodied Intelligence | Embodied AI & Robotics | Angel | Nearly CNY 100 million | — | Original |
| 2026-09-20 | GENISOM AI | Embodied AI & Robotics | Series B | Several hundred million CNY | — | Original |
| 2026-09-20 | Jingneng Microelectronics | Chips | Series C | CNY 630 million | — | Original |
| 2026-09-18 | Xili Optoelectronics | Optics & Networking | Pre-A | On the order of CNY 100 million | — | Original |
| 2026-09-17 | D-Robotics | Embodied AI & Robotics | Series C | USD 400 million | — | Original |
| 2026-09-16 | Siwei Technology | Chips | First round | Nearly CNY 200 million | — | Original |
| 2026-09-15 | ENCOS | Embodied AI & Robotics | Series B | More than CNY 300 million | — | Original |
| 2026-09-10 | Raysolve | Chips | Pre-A4 | Nearly CNY 100 million | — | Original |
| 2026-09-09 | Guoke Guangxin | Optics & Networking | Series B+ | Several hundred million CNY | — | Original |
| 2026-09-09 | Weina Hexin | Chips | Series C1 | CNY 1 billion | — | Original |
| 2026-09-08 | Tianji Intelligence | Embodied AI & Robotics | Series B++ | Undisclosed | — | Original |
| 2026-09-08 | Xiaoyu Intelligent Manufacturing | Embodied AI & Robotics | Series B3 | Several hundred million CNY | — | Original |
| 2026-09-08 | Qianjue Technology | Embodied AI & Robotics | Series A+ | Several hundred million CNY | — | Original |
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Sources: GDELT and the linked original disclosures.