Fastprint
兴森科技
From PCB prototypes to ABF substrates, covering all three packaging tiers
- Headquarters
- Shenzhen, Guangdong
- Region
- Shenzhen
- Founded
- 1999
- Stage
- Public
Overview
Shenzhen Fastprint Circuit Tech was founded in 1999 and listed on the Shenzhen Stock Exchange in June 2010. The company positions itself as a digital manufacturing provider of advanced electronic circuit solutions, with a product layout that covers all three tiers of electronic hardware packaging and offers end-to-end solutions from design to test and delivery. Customers span communications, data centres, industrial control, medical and consumer electronics. ABF substrates are its key bet in the IC packaging substrate segment.
Products
4PCB prototype and small-batch
Fast-turn boards for design verification and ramp-up
IC substrate (ABF)
Ajinomoto build-up film substrates for high-pin-count packages
SMT assembly
Board-level assembly and component mounting
Semiconductor test board
Load boards and probe cards for chip test
Highlights
3- 01H1 2026 revenue of RMB 4.04 billion (+17.9% YoY) and net profit of RMB 111 million (+283.3% YoY), with gross margin at 21.0%.
- 02Full-year 2025 revenue of RMB 7.19 billion (+23.7% YoY) with net profit of RMB 135 million (+168.1% YoY).
- 03Headcount stands at 7,761 with a debt-to-asset ratio of 64.6% - the typical leverage profile of a company still ramping substrate lines.
People
1
Funding
1- Source
IPO
CNY 9.666 亿
Events
0Not yet listed
Related projects
0Not yet listed
Topics
4Coverage
1Information compiled from public sources; refer to the company's official website for authoritative details.