Companies

ACM Research (Shanghai), Inc.

盛美上海

Domestic wet-cleaning champion whose SAPS/TEBO megasonic and Tahoe single-wafer-batch cleaning platforms are installed at 28nm and below.

AMEC (Advanced Micro-Fabrication Equipment)

中微公司

China's leading plasma etch and MOCVD equipment maker for advanced logic, memory and compound-semiconductor fabs.

Fastprint

兴森科技

From PCB prototypes to ABF substrates, covering all three packaging tiers

Hua Hong Semiconductor

华虹半导体

Leading specialty process foundry in China

Innoscience (Suzhou) Technology Holding

英诺赛科

The world's first IDM to mass-produce 8-inch silicon-based GaN, and the global leader in GaN power semiconductors.

NAURA Technology Group

北方华创

China's largest semiconductor equipment platform, spanning etch, thin film, furnaces, cleaning and advanced packaging tools.

Nexchip Semiconductor

晶合集成

Hefei-based foundry focused on display drivers, CIS and power platforms

Piotech Inc.

拓荆科技

China's thin-film deposition platform — PECVD, ALD and hybrid bonding — with tools running in more than 100 production lines.

SICC Co., Ltd.

天岳先进

China's leading silicon-carbide substrate maker, ranked among the world's top-three suppliers of SiC single-crystal substrates.

SMIC

中芯国际

Largest semiconductor foundry in mainland China

Shennan Circuits

深南电路

PCB plus IC substrate: China's earliest mover in packaging substrates

Skyverse Technology

中科飞测

Domestic inspection and metrology equipment for chip quality control

WUS Printed Circuit

沪电股份

The high-layer-count PCB supplier behind AI switches and accelerator cards