Companies

Fastprint

兴森科技

From PCB prototypes to ABF substrates, covering all three packaging tiers

JCET Group

长电科技

Global chip assembly and test house, from wafer probing to drop-ship

Shennan Circuits

深南电路

PCB plus IC substrate: China's earliest mover in packaging substrates

Tongfu Microelectronics

通富微电

Top-tier OSAT serving global customers with one-stop design-to-test services